On August 26, semiconductor equipment factory Wynn Technology transferred to the cabinet at NT$360 per share. However, under the expectations of market investors, the market opened 44% that day, and the share price reached a price of RMB519 per share. Recently, it has benefited from the global semiconductor hot trend. With the rapid growth of NTD in August, Telco has returned to the market for its focus. Its stock price not only returned to the 500 yuan rating, but also exceeded the previous high of 552 yuan and created a new high of 553 yuan. Behind this stock price performance, it has relied on excellent technical innovation and flexible market layout, not only has it become an important supplier of 70% of the automatic equipment for thermal film production in the market, but also has become an important partner of seven of the world's top ten captive testing factories.
Jingten Technology was founded in 1994. At that time, Xu Jiaxin, the general manager of Xu Jiaxin, who was only 27 years old and had served as an engineer at the testing factory Huatai, and Wang Yuqin, a co-worker of automatic equipment parts agent Wang Huiyan. The three of them paid 2 million yuan and resolutely invested in the semiconductor equipment field with high capital expenditures. Xu Jiaxin said that at that time, the three of them were optimistic about the prospects of the semiconductor equipment industry, and they still did not have too much burdens, so they fell into the market. This kind of adventure and entrepreneurial spirit has laid the foundation for the future development of Huanteng Technology.
Because the three entrepreneurs had experience in sealing the testing factory and automatic parts, the founding of Huanteng Technology demonstrated its ability to solve customer problems. Xu Jiaxin pointed out that customers had always changed due to collisions due to IC pins (Pin). In the case where international factories could not solve the problem, they could not detect chip performance. Finally, led by current technical director Wang Yuqin, Wang Ting developed products that can effectively reduce the impact of ICs, which further won the customer's youth, and became a supplier of suppliers such as Sun and Moonlight and Silicon products from the captive factory.
After, JINTEN Technology has entered the past market of Japanese and Korean manufacturers to control the spot and heat-spraying and dispersing flakes. During this period, Hunten Technology cooperated with Sun and Moonlight to develop embedded devices that can integrate related processes. The challenge for such embedded devices is how to accurately handle heat dissipation on the points. In this regard, Wang Yuqin, who is a talented in automatic materials, has developed his talent. After overcoming the problem of environmental interference and glue, he has greatly improved the accuracy of glue. Even, Hunten Technology has modulated various equipment, which can further quickly change design and assembly in a short time and further deliver products. Such a flexible approach made Viagra occupy the high-performance chip market such as GPU and CPU in 2005. Therefore, with the popularity of the AI chip wave in 2022, Hunting Technology naturally benefits from the power consumption and heat dissipation demand of AI chips, driving continuous growth in the past three years.
In the current increase in the demand for AI chip dissipation, the layout of Janet Technology is not only limited to traditional FCBGA packaging. The oS segment of advanced packaging CoWoS, including Sun and Moonlight Kaohsiung Factory and Silicon Taichung Factory, also adopt Janet Technology's equipment. Xu Jiaxin admitted that because AI chips are expensive, customers have more stringent requirements for equipment. Through the regular development of customers, we can understand the demand, which has increased from 10 kg to 100 kg in terms of heat dissipation pressure. Even, we jointly develop a new generation of heat dissipation materials with our customers to meet our customers' needs for technological upgrades.
In addition to the main automatic product line, Hunting has also developed in automatic optical detection (AOI) equipment and 3D testing equipment. Xu Jiaxin pointed out that due to the increasing cost of semiconductor products, full inspections were only conducted before shipment in the early stages, but now every process needs to be tested. Janet's AOI equipment has been adopted by many sealed testers. The newly developed 3D testing equipment is more suitable for international factory KLA and has been introduced by customers. In the future, the revenue expectations related to AOI and 3D detection will have the opportunity to exceed 30% and become a new growth dynamic. In addition, Wang Teng Technology's enterprise positioning has also been gradually transformed from a single pure automatic equipment factory, Wang Teng is gradually transforming into a supplier with the ability to solve heat dissipation interface materials.
Xu Jiaxin pointed out that because the company is very clear about what the packaging is for, it has been deeply involved in the past few years of research on heat dissipation interface materials, from traditional heat dissipation paste, to graphene, and later metal flakes (Metal Tint) or liquid metal (Liquid Metal). Because different heat dissipation materials require completely different equipment technologies. For example, heat dissipation paste may use screw pressing, while metallic sheets require spray paste technology, and graphene is pasted like paste. Special equipment cannot be developed without understanding the properties of the material, so Janet has been able to handle at least five to six materials and provide corresponding solutions. This in-depth understanding of materials science and equipment development combines the combination of a more closely connected understanding of materials science, allowing Hunter to cooperate with customers and material manufacturers to jointly develop new heat dissipation technologies that meet market needs.
At the moment of complicated ground politics, Xu Jiaxin pointed out that Wang Teng Technology adopts the strategy of "sustaining the market". At present, the markets of Teng are mainly distributed in Taiwan (more than 60%) and China (more than 30%). As for the US market, although large manufacturers such as Taiwan Electric Power were sold out, Wang Teng still mainly used the agency model in the early stage. The reason is that the cost of equipment in the United States is too high, especially the expensive labor costs. Therefore, if the quantity is not large, cooperation with domestic equipment providers to support each other through the agency model is more cost-effective. Unless the market is large enough to support local companies, it will not easily invest in the cost of the factory. This practical and prudent strategy ensures that the company can effectively control risks while expanding globally.
Looking ahead, Xu Jiaxin pointed out that the competition for heat dissipation materials has not yet ended, and Junten Technology will continue to work with customers to solve solutions. In the 3D inspection field, although this is a long-term project that takes ten years to deploy, the market verification time is long. However, this is a long-term road that must be invested, and it is expected to make significant contributions to the company's revenue after three to five years.
General Xu Jiaxin said that the company's three major acquisition columns, including heat dissipation material solution, testing equipment (AOI and 3D testing), and customized equipment that targets customer needs, will be sufficient to support future development. Especially in the field of customization, it has become the mainstream of the market due to the new irregular chip shape and size changes. With its rapid response capabilities in optical and electrical integration, Cangten Technology will have the opportunity to take the lead in the development of new products.