According to comprehensive foreign media reports, according to Micron’s latest public documents, Micron’s wafer fab near Clay, New York, has been delayed again and is not expected to go online until the end of 2033.
According to the document, Micron originally planned to start construction of the first wafer fab (Fab 1) at the end of 2026 and open the first wafer fab in mid-2028. It is now expected to start operations at the end of 2030; the second fab (Fab 2) was originally expected to start in the second half of 2028, but the completion time has been extended from 2030 to the end of 2033; the remaining two fabs (Fab 3 and Fab 2) were originally expected to start in the second half of 2028. 4) Originally expected to be commissioned in 2035 and 2041 respectively. However, the construction schedule will also be lengthened, and the construction period of the first fab will be extended from three years to four years.
Reports indicate that the entire New York Clay campus will be fully completed and reach full production in 2045, five years later than originally planned. Although Micron did not share specific reasons for the delay, it may be related to changes in requirements in the US$6.1 billion financing agreement signed by the U.S. Department of Commerce.
At the same time, while delaying the construction of the New York plant, Micron is accelerating the construction of the Idaho plant and reallocating funds from the CHIPS Act to facilities in Idaho. In other words, the two Idaho wafer fabs (one existing and one planned) will be completed before the Clay plant, indicating a strategic adjustment in project priorities.
As part of the adjustment, Micron reportedly transferred about $1.2 billion in federal grants from New York to Idaho, reducing funding for the Clay campus from $4.6 billion to $3.4 billion. Micron said this update is consistent with evolving project requirements under federal agreements.
If the project adjustment is true, it is not expected to affect Micron's ultimate goal of producing 40% of DRAM in the United States, because the company adopts a project-by-project priority strategy rather than delaying the construction of new factories. At the same time, prioritizing the construction of Idaho ID2 will benefit Micron's U.S. HBM production and will establish a high-end packaging facility in Idaho to produce memory products that require high-end packaging.
Micron chip factories in Upstate NY will be delayed by 2-3 years, company says Micron delays New York chipmaking fabs by five years, but accelerates second fab in Idaho and reallocates CHIPS Act funding Further reading: Musk confirmed that AI6 will adopt a dual-manufacturing strategy! Samsung and TSMC synchronize production The United States plans to levy annual fees based on patent value! Industry warning: fear of hollowing out small and medium-sized enterprises and hitting U.S. technology development